Please find below a list of Used , surplus and pre-owned CMP Equipment (Chemical mechanical planarization equipment) for sale by fabsurplus.com -Click on any list item to see further data. Chemical mechanical polishing, or CMP, also known as chemical mechanical planarization, is a process of smoothing and thinning surfaces with a mixture of chemical and mechanical forces. We can consider it to be a hybrid of chemical etching and abrasive polishing. It is used in the semiconductor industry to polish and thin semiconductor wafers as part of the IC manufacturing process.
| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time | |
|---|---|---|---|---|---|---|---|---|---|
| 111447 | Accretech / TSK | HRG-200X | Fully Automatic Grinder | 200 mm | 01.12.2022 | 1 | as is where is | immediately | |
| 96534 | Applied Materials | Mirra Mesa | CMP system | 200 mm | 1 | inquire | |||
| 96537 | Applied Materials | Mirra Ontrak | Poly/STI CMP | 200 mm | 01.05.1999 | 1 | inquire | ||
| 96538 | Applied Materials | Mirra Ontrak | Poly/STI CMP | 200 mm | 31.05.1999 | 1 | inquire | ||
| 100868 | Applied Materials | Mirra Mesa | CMP System | 200 mm | 1 | inquire | 5 months | ||
| 100873 | Applied Materials | Mirra Mesa Integrated | Oxide/STI CMP | 200 mm | 01.05.1999 | 1 | inquire | ||
| 105881 | Applied Materials | Reflexion GT | CMP system with integrated cleaner | 300 MM | 01.05.2011 | 1 | as is where is | immediately | |
| 106065 | Applied Materials | Mirra ® 3400 | Stand-Alone CMP System | 200 mm | 01.06.2001 | 1 | as is all rebuilt | immediately | |
| 106203 | Applied Materials | Mirra 3400 Stand-Alone | Oxide/STI CMP | 200 mm | 01.06.1998 | 1 | inquire | ||
| 106980 | Applied Materials | Reflexion | CMP system | 300 mm | 1 | inquire | immediately | ||
| 106981 | Applied Materials | Reflexion LK | CMP system | 300 mm | 1 | inquire | immediately | ||
| 106982 | Applied Materials | Mesa | CMP cleaning system | 300 mm | 1 | inquire | immediately | ||
| 106983 | Applied Materials | Desica | CMP Cleaning system | 300 mm | 1 | inquire | immediately | ||
| 106984 | Applied Materials | Kawasaki 4.0 | Fab Interface Module | 300 mm | 1 | inquire | immediately | ||
| 109063 | Applied Materials | Mirra Mesa | Oxide CMP system, with SMIF | 200 mm | 1 | inquire | 1 month | ||
| 110767 | Applied Materials | Mirra 3400 Ontrak | CMP Polisher with Cleaning System | 200 mm | 01.05.1997 | 1 | as is where is | immediately | |
| 111636 | Applied Materials | Mirra Integra Dielectric | Dielectric CMP | 150mm | 1 | as is where is | |||
| 112116 | Applied Materials | Reflexion | CMP Oxide | 300 mm | 01.06.2006 | 1 | as is where is | ||
| 112117 | Applied Materials | Reflexion LK | CMP Oxide | 300 mm | 01.06.2008 | 1 | as is where is | ||
| 112118 | Applied Materials | Reflexion LK | CMP W | 300 mm | 01.06.2012 | 1 | as is where is | ||
| 113203 | Applied Materials | Reflexion LK Oxide | Low K Oxide CMP | 300 mm | 1 | as is where is | |||
| 114073 | Applied Materials | Reflexion LK - Poly/STI | Poly/STI CMP | 300 mm | 1 | as is where is | |||
| 114074 | Applied Materials | Reflexion LK Copper | Copper CMP | 300 mm | 1 | as is where is | |||
| 114075 | Applied Materials | Reflexion LK Oxide | Dielectric CMP | 300 mm | 1 | as is where is | |||
| 114254 | Applied Materials | MIRRA 3400 Integrated | CMP Polishing system configured for use with a DNS-AS2000 cleaner (Also available for purchase) | 200 mm | 01.08.1998 | 1 | as is where is | immediately | |
| 111438 | Buehler | Beta Series Twin Variable Speed Grinder-Polisher | GRINDER-POLISHER | 01.04.2008 | 1 | as is where is | immediately | ||
| 111443 | Buehler | 49-5102-230 | Twin Variable Speed Grinder Polisher with Vector Power Head | 01.06.2001 | 1 | as is where is | immediately | ||
| 113475 | Cybeq | 8000 | CMP | 150 mm | 01.06.1997 | 1 | as is where is | ||
| 113476 | Cybeq | 8000 | CMP | 150 mm | 01.06.1997 | 1 | as is where is | ||
| 113477 | Cybeq | 8000 | CMP | 150 mm | 01.06.1997 | 1 | as is where is | ||
| 110800 | Disco | DGP8761 with DFM2800 | Wafer Back Grinder with Wafer Taper | 300 mm | 01.06.2012 | 1 | inquire | immediately | |
| 113478 | Disco | DFG850 | Fully Automatic Grinder | 150 mm | 1 | as is where is | |||
| 98460 | Ebara | Frex 300 | Tungsten CMP tool | 300 mm | 1 | as is where is | immediately | ||
| 98461 | Ebara | Frex 300 | STI CMP ( missing front end robot and load port) | 300 mm | 1 | as is where is | immediately | ||
| 108409 | Ebara | FREX300S Poly/STI | Poly/STI CMP | 300 mm | 1 | as is where is | |||
| 110757 | Ebara | FREX 300 | Tungsten CMP system | 300 mm | 2 | as is where is | immediately | ||
| 110796 | Ebara | FREX 300 | Tungsten CMP tool | 300 mm | 01.05.2005 | 2 | as is where is | immediately | |
| 111596 | Ebara | EPO 222 | Oxide CMP | 200 mm | 01.02.1999 | 1 | as is where is | immediately | |
| 111726 | Ebara | FREX300S Dielectric | Dielectric CMP | 300mm | 1 | as is where is | |||
| 111728 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm | 1 | as is where is | |||
| 111729 | Ebara | FREX300S Tungsten | Tungsten CMP | 300mm | 1 | as is where is | |||
| 112173 | EBARA | EPO-2228 | CMP Oxide | 200 mm | 01.06.1999 | 1 | as is where is | ||
| 112174 | EBARA | EPO-223 | CMP W | 200 mm | 01.06.1997 | 1 | as is where is | ||
| 112175 | EBARA | F-REX300 | CMP W | 300 mm | 01.06.2010 | 1 | as is where is | ||
| 112176 | EBARA | F-REX300S2 | CMP W | 300 mm | 01.06.2009 | 1 | as is where is | ||
| 114092 | Ebara | EPO-222 Tungsten | Tungsten CMP | 200 mm | 1 | as is where is | |||
| 114093 | Ebara | FREX300 Tungsten | Tungsten CMP | 300 mm | 1 | as is where is | |||
| 114094 | Ebara | FREX300S Tungsten | Tungsten CMP | 300 mm | 1 | as is where is | |||
| 114095 | Ebara | FREX300S Tungsten | Tungsten CMP | 300 mm | 1 | as is where is | |||
| 114096 | Ebara | FREX300S Tungsten | Tungsten CMP | 300 mm | 1 | as is where is | |||
| 114097 | Ebara | FREX300S Tungsten | Tungsten CMP | 300 mm | 1 | as is where is | |||
| 114098 | Ebara | FREX300S2 | Multi-Process CMP | 1 | as is where is | ||||
| 71907 | Hamamatsu | C7103 | PC Controlled IC Back-side Lapping and Wafer Grinding System | 200 mm and packages | 01.09.2001 | 1 | as is where is | immediately | |
| 98465 | IPEC | 472 | CMP Polishing system | 150 MM / 200 mm | 3 | as is where is | immediately | ||
| 98466 | IPEC | 472 | CMP | 150 mm | 2 | as is where is | immediately | ||
| 109184 | IPEC | 372M | Multi-Process CMP | 200mm | 1 | as is where is | |||
| 113803 | LAM | Avangard 776 | TF CMP Oxide POLISH OX | 150 mm | 01.06.1996 | 1 | as is where is | ||
| 113804 | LAM | Avangard 776 | TF CMP Oxide POLISH OX | 150 mm | 01.06.1996 | 1 | as is where is | ||
| 113805 | LAM | Avangard 776 | TF CMP Tungsten POLISH W | 150 mm | 01.06.1996 | 1 | as is where is | ||
| 113831 | LAM | DSS-200 | WET ETCH WET Chemical Clean POST CMP CLEANER | 150 mm | 01.06.1996 | 1 | as is where is | ||
| 113835 | LAM | SYNERGY | TF WET Chemical Clean CLEANER | 150 mm | 1 | as is where is | |||
| 113836 | LAM | SYNERGY | TF WET Chemical Clean CLEANER | 150 mm | 1 | as is where is | |||
| 113549 | Lam Research | Ontrak DSS200 series II | Post CMP scrubber | 150 mm | 01.06.1997 | 1 | as is where is | ||
| 113550 | Lam Research | Synergy | Post CMP scrubber | 150 mm | 01.06.1997 | 1 | as is where is | ||
| 113551 | Lam Research | Synergy | Post CMP scrubber | 150 mm | 01.06.1999 | 1 | as is where is | ||
| 113552 | Lam Research | Synergy | Post CMP scrubber | 150 mm | 01.06.1997 | 1 | as is where is | ||
| 106820 | Lam Research Ontrak | Synergy | Post CMP cleaner with HEPA mini-environment | 200 mm | 1 | as is where is | immediately | ||
| 111584 | Lam Research Ontrak | Synergy | Post CMP cleaner with HEPA mini-environment | 200 mm | 1 | as is where is | immediately | ||
| 108846 | MICROAUTOMATION | M-1100 | Wafer Dicing Saw, for up to 6" Wafers | 150 MM | 1 | inquire | |||
| 108191 | NOVELLUS | 676 | CMP System Polisher | 200 mm | 01.06.1997 | 1 | as is where is | ||
| 111884 | Strasbaugh | 6DS-SP | Multi-Process CMP | 200 mm | 01.06.1995 | 12 | as is where is | immediately |