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DNS AS-2000 Post CMP cleaning system for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used DNS AS-2000 Post CMP cleaning system.
Please click on the "Get Quote" button at the end of the AS-2000 description, if you'd like to get a quotation, photos and specifications of this Post CMP cleaning system, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This DNS AS-2000 Post CMP cleaning system is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


DNS AS-2000 Equipment Details

SDI ID: 114257
Manufacturer: DNS
Model: AS-2000
Description: Post CMP cleaning system
Version: 200 mm
Vintage: 01.06.1999
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

DNS® / DAINIPPON® AS-2000
A Compact CMP Wafer Cleaner with a High Throughput
The DNS AS-2000 is a post-CMP cleaner designed so as to achive high productivity. By reducing wafer transfer and drying time, throughput is improved by 50% over previous models. Footprint is also reduced by optimally arranging each processing unit. Moreover, inline configuration with a chemical mechanical polisher system is also possible.

Key features:
-The wet loader prevents wafer dehydration, enabling effective removal of slurries and other particles left on the wafers after CMP.
-After cleaning both sides of a wafer with a disk brush, the wafer surface is precisely cleaned with a horizontally rotating brush.
D-Sonic cleaning with 1.5MHZ ultrasonic DI water is also available.
-Productivity It can process 60 or more wafers per hour.
-Footprint is reduced by 25%.
-Inline configuration with chemical mechanical polisher is available.
-Can be applied to both post-oxide-CMP cleaning and post-metal-CMP cleaning.

-This system was professionally de-installed from working condition in February 2024.
-It is currently located at the warehouse and can be inspected by appointment.
-It was used in the fab with a Mirra 3400 Polisher, which is also available for purchase.
-It was used for Tungsten CMP.

Process configuration is: Dual brush and top-side brush chambers, with spin dry.

WAFER SIZE: 8 INCH    
PROCRESS TYPE: WET/ CMP    
COMPONENTS :     
MAINFRAME
CHEMICAL CABINET x 2EA
MX-7500 TBC BRUSH LOAD CELL AMP    
PRE-TECH FINEJET GENERATOR    
AC TRANSFOMER    
FA-21000A PC    
SGD DRIVE_YASKAWA    
HF CIRCULATION FILTER    
UT3-F3AE-B TOUCH PANEL    
HFC-VWE HITACHI INVERTER    
RORZE CURT-2032-0     
SLURRY FLOW CONTROLLER INTERFACE/ POWER BOX   

Item 1:    MAIN FRAME    213 cm X 188 cm  X 221 cm
Item 2    CHEMICAL CABINET 1    76 cm X 135 cm  X 206 cm
Item 3    CHEMICAL CABINET 2    76 cm X 127 cm X 188 cm

-The tool come with a decontamination certificate


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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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