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| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time | |
|---|---|---|---|---|---|---|---|---|---|
| 111088 | Axcelis | 17308500 | ARC CHAMBER W-ELS/VAE, W, HIGH PURITY - AXCELIS HE3 | Spares | 5 | inquire | |||
| 112205 | KLA | Aleris HX8500 | Metrology Aleris Ellipsometer Thin Film Measurement System | 300 mm | 01.06.2008 | 1 | as is where is | ||
| 112224 | Kokusai | RAM-8500ZX | Asher | 200 mm | 01.06.1996 | 1 | as is where is | ||
| 110688 | NITTO | DR8500 II | Wafer Taper | 200 mm | 01.06.1996 | 1 | as is where is | immediately | |
| 110689 | NITTO | HR8500 II | Wafer De-Taper | 200 mm | 01.06.1996 | 1 | as is where is | immediately | |
| 32210 | Nitto | HR8500-2 | INSTRUCTION MANUAL | MANUAL | 1 | as is where is | immediately | ||
| 32212 | Nitto | DR8500-2 | INSTRUCTION MANUAL | MANUAL | 2 | as is where is | |||
| 112280 | Rudolph | 3Di8500 | Metrology Macro inspection | 300 mm | 01.06.2008 | 1 | as is where is | ||
| 106533 | Sikama | Falcon 8500 | REFLOW OVEN | SMT | 01.06.2015 | 1 | as is where is | immediately | |
| 108120 | TEL Tokyo Electron | TE8500 | Dry Etch | 200 mm | 1 | as is where is | |||
| 112496 | TEL Tokyo Electron | TE8500 | Etch Oxide | 200 mm | 01.06.1996 | 1 | as is where is | ||
| 112986 | West-Bond | 8500 | Automatic Wedge Bonder | ASSEMBLY | 1 | as is where is |