SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time | |
---|---|---|---|---|---|---|---|---|---|
111664 | ASM | NUCLEUS XP | Wafer Substrate Bonding | 300mm | 1 | as is where is | |||
112172 | DYNATECH | DT-NWM1050DM | Wafer Mounter | 200 mm | 01.06.2008 | 1 | as is where is | ||
106467 | EO Technic | CSM-2000 | CHIP SCALE LASER MARKER | 150 mm/200 mm | 01.06.2002 | 1 | as is where is | immediately | |
106469 | EO Technics | CSM2000 | CHIP SCALE LASER MARKER | 150 mm/200 mm | 1 | as is where is | immediately | ||
106470 | EO TECHNICS | CSM2000 | CHIP SCALE LASER MARKER | 200 mm | 01.06.2005 | 1 | as is where is | immediately | |
101819 | EVG | 820 | Mold Carrier Lamination System | 200 mm | 1 | as is where is | immediately | ||
108816 | EVG | Smart View | Wafer Aligner - Parts Only | 1 | as is where is | ||||
109593 | EVG | Gemini | Automated Production Wafer Bonder | 300 mm | 1 | inquire | |||
109611 | EVG | 520 | Wafer Bonder | 150 mm | 1 | inquire | |||
110746 | EVG | Gemini | Wafer Bonding system - permanent bonding system | 150 mm | 01.06.2015 | 5 | as is where is | immediately | |
111732 | EVG | 850DB | Automated Debonding System | 200mm | 1 | as is where is | |||
112763 | EVG | EV640 | Wafer to Wafer Bond Aligner | 1 | as is where is | ||||
112764 | EVG | Smartview Bond Aligner | 300mm Wafer to Wafer Bond Aligner | 300 mm | 1 | as is where is | |||
113957 | EVG | 501 | Wafer Bonder | 150 mm | 1 | inquire | |||
112844 | Logitech | BC1 | Wafer Bonder Controller | 1 | as is where is | ||||
112894 | Osiris International | DEFIXX 15m | Wafer Debonding Tool -- Manual 0 150mm | 150 mm | 1 | as is where is | |||
110733 | POWATEC | 850 | Manual Wafer Mounter | 01.06.2000 | 1 | as is where is | immediately | ||
108299 | Suss MicroTec | CB200 | High Pressure Wafer Bonding Chamber | 200 mm | 01.06.2012 | 1 | as is where is | immediately | |
111449 | SUSS Microtec | MCS8 + SBS6 Gen 2 + DB12T + SD12 | Spin Coater + Wafer Bonder + Debonder _ Debonded wafer Cleaner | 200 mm | 01.09.2022 | 1 | as is where is | immediately | |
112298 | SUSS MicroTec | CB200M | Wafer Bonder | 200 mm | 01.06.2012 | 1 | as is where is | ||
112299 | SUSS MicroTec | CBC200 | EU Bonder | 200 mm | 01.06.2006 | 1 | as is where is | ||
112300 | SUSS MicroTec | CBC200 | Wafer Bonder | 200 mm | 01.06.2013 | 1 | as is where is | ||
108128 | TOK | 12262 | Wafer bonder | 1 | as is where is | ||||
108129 | TOK | 12263 | Wafer Debonder | 1 | as is where is | ||||
103635 | Toray | SP-500w | Bump Height Measurement | 300 mm | 1 | as is where is | |||
108130 | TORAY | FC3000L2 | FLIP CHIP Line | 0 | as is where is | ||||
111997 | Toray Engineering Co., Ltd. | FC3000WL | Flip Chip Bonder | Assembly | 1 | as is where is | |||
111998 | Toray Engineering Co., Ltd. | PB3000 | Flip Chip Bonder | Assembly | 1 | as is where is | |||
106557 | Ultron | UH108 | Ultron Tabletop Laminator | 150 mm/200 mm | 01.06.2005 | 1 | as is where is | immediately | |
106560 | V-Tek | TM-330 | TM-330 | 150 mm/200 mm | 1 | as is where is | |||
106563 | Veeco Wyko | NT3300 | 3D Bump Height (Veeco) | 150 mm/200 mm | 1 | as is where is | immediately |