fabsurplus.com


SDI ID Manufacturer Model Description Version Vintage Q. ty Sales Conditions Lead Time
111664 ASM NUCLEUS XP Wafer Substrate Bonding 300mm 1 as is where is
112172 DYNATECH DT-NWM1050DM Wafer Mounter 200 mm 01.06.2008 1 as is where is
106467 EO Technic CSM-2000 CHIP SCALE LASER MARKER 150 mm/200 mm 01.06.2002 1 as is where is immediately
106469 EO Technics CSM2000 CHIP SCALE LASER MARKER 150 mm/200 mm 1 as is where is immediately
106470 EO TECHNICS CSM2000 CHIP SCALE LASER MARKER 200 mm 01.06.2005 1 as is where is immediately
101819 EVG 820 Mold Carrier Lamination System 200 mm 1 as is where is immediately
108816 EVG Smart View Wafer Aligner - Parts Only 1 as is where is
109593 EVG Gemini Automated Production Wafer Bonder 300 mm 1 inquire
109611 EVG 520 Wafer Bonder 150 mm 1 inquire
110746 EVG Gemini Wafer Bonding system - permanent bonding system 150 mm 01.06.2015 5 as is where is immediately
111732 EVG 850DB Automated Debonding System 200mm 1 as is where is
112763 EVG EV640 Wafer to Wafer Bond Aligner 1 as is where is
112764 EVG Smartview Bond Aligner 300mm Wafer to Wafer Bond Aligner 300 mm 1 as is where is
113957 EVG 501 Wafer Bonder 150 mm 1 inquire
112844 Logitech BC1 Wafer Bonder Controller 1 as is where is
112894 Osiris International DEFIXX 15m Wafer Debonding Tool -- Manual 0 150mm 150 mm 1 as is where is
110733 POWATEC 850 Manual Wafer Mounter 01.06.2000 1 as is where is immediately
108299 Suss MicroTec CB200 High Pressure Wafer Bonding Chamber 200 mm 01.06.2012 1 as is where is immediately
111449 SUSS Microtec MCS8 + SBS6 Gen 2 + DB12T + SD12 Spin Coater + Wafer Bonder + Debonder _ Debonded wafer Cleaner 200 mm 01.09.2022 1 as is where is immediately
112298 SUSS MicroTec CB200M Wafer Bonder 200 mm 01.06.2012 1 as is where is
112299 SUSS MicroTec CBC200 EU Bonder 200 mm 01.06.2006 1 as is where is
112300 SUSS MicroTec CBC200 Wafer Bonder 200 mm 01.06.2013 1 as is where is
108128 TOK 12262 Wafer bonder 1 as is where is
108129 TOK 12263 Wafer Debonder 1 as is where is
103635 Toray SP-500w Bump Height Measurement 300 mm 1 as is where is
108130 TORAY FC3000L2 FLIP CHIP Line 0 as is where is
111997 Toray Engineering Co., Ltd. FC3000WL Flip Chip Bonder Assembly 1 as is where is
111998 Toray Engineering Co., Ltd. PB3000 Flip Chip Bonder Assembly 1 as is where is
106557 Ultron UH108 Ultron Tabletop Laminator 150 mm/200 mm 01.06.2005 1 as is where is immediately
106560 V-Tek TM-330 TM-330 150 mm/200 mm 1 as is where is
106563 Veeco Wyko NT3300 3D Bump Height (Veeco) 150 mm/200 mm 1 as is where is immediately


Not the item you were looking for?



Ask SDI fabsurplus.com!

If you can't find what you need, or are looking for a specific piece of semiconductor equipment let us know what type of semiconductor manufacturing equipment you would like to buy, and we will conduct a search for what you are looking for.

Inquiry