Novellus SABRE XT Electro-chemical deposition (For Copper). for Sale

NOVELLUS / LAM SABRE XT PLATING TOOL consisting of:

- Manufacturer: Novellus / LAM
- Model: Sabre XT
- 3 open cassette load stations
- 5 anneal chambers
- 3 Electrofill Cells (Plating Cells)
- 3 Post Electrofill Cells (PEMs) with EBR hardware
- System does not have hard drives installed
Condition:Used
Condition:As-Is / Where-Is Condition.
Description:Novellus / LAM Sabre XT Plating Tool

The Novellus Systems SABRE TM xT system is an electrofill system that uses an
electroplating process to deposit copper onto seeded 200 or 300 mm wafers.
A variety of options are available for the SABRE xT, including the anneal
option, the EBR option, the CMS option, and either an ergonomic cassette
loader (ECL) option for 200 mm systems or a podloader/FOUP option, for
300 mm systems

Electrofill Cell Hardware Description
Hardware elements that have an effect on the process results are described as
follows.
Anode Spacer: The anode spacer is located between the anode chamber and
the plating fountain base. The anode spacer thickness determines the anode
chamber height in the plating cell and influences the distance between the
anode chamber and the clamshell. A larger anode spacer tends to reduce the
deposit thickness toward the wafer edge relative to the center or nominal. The
typical anode spacer thickness is 0.5 inches (200 mm) or 0.25 inches (300 mm).
Anode Stem: The anode stem connects the plating solution inlet to the
plating solution nozzle. The anode tubes/flutes install into holes in the anode
stem.
Anode: The anodes used in SABRE are usually about 1 inch thick and may
have grooves in them. The grooves increase the surface area of the anode. The
anode is composed of >99.99% pure copper and contains approximately
500 ppm of phosphorous. The addition of phosphorous helps form a stable
black film on the anode, which prevents anodic oxidation by the accelerator.
Anode Tubes/Flutes: The anode tubes provide plating solution flow into the
anode chamber. Too much flow will increase breakdown of the organics while
too little flow will induce passivation problems. Some tools have anode flutes
instead of tubes. Flutes provide better convection currents in the anode
chamber when compared to anode tubes.
Anode Vents: Anode vents provide an exhaust for the plating solution
flowing into the anode chamber. The vent size is typically 1/8 inch and ex-
hausts into the reclaim loop via a black tube. Anode vent size is critical for
controlling flow through the anode chamber.
Anode Membrane: The anode membrane is a porous (~10 μ m) polyethylene
membrane. The anode membrane helps to isolate the anode film fragments
from the wafer.
Plating Solution Nozzle: The plating solution nozzle connects to the end of
the stem and provides a flow of plating solution into the plating cell. There are
two versions: tophatted and tophatless, but they perform the same function.
Diffuser: The diffuser is a porous (7 to 50 μ m depending on tool configu-
ration) polyethylene membrane. The diffuser pressurizes the area between the
anode membrane and diffuser forcing a very laminar flow of the plating so-
lution to the wafer. The diffuser membrane is mounted at a 3° (200 mm) or 2°
angle (300 mm) within the holder and has a vent at the high end. This ar-
rangement ensures that bubbles are eliminated more easily during the start of
processing.