Please find below an alphabetically ordered list of used semiconductor manufacturing equipment , test equipment, assembly equipment and SMT equipment we have for sale, updated in real time on fabsurplus.com via the SDI worldwide "DataNET".
SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
---|---|---|---|---|---|---|---|---|
109082 | 8 inch | Complete | Wafer fab Line for sale | 200 mm | 01.06.1998 | 470 | as is where is | immediately |
108645 | 8 inch / 6 inch | Partial | Bumping Wafer Fab Line | 150 mm / 200 mm | 01.06.2005 | 79 | as is where is | immediately |
90089 | DISCO | DFL7160 | WBL LASER SAW (DAF Type) | 300 mm | 01.05.2012 | 1 | as is where is | immediately |
106461 | Disco | DFD6361 | DICING SAW | 150-200 mm | 01.11.2009 | 1 | as is where is | immediately |
106462 | Disco | DFD6362 | DICING SAW | 150 mm/200 mm | 01.05.2016 | 1 | as is where is | immediately |
106463 | Disco | DFD651 | 8" Dual Spindle Automated DICING Saw | 150 mm/200 mm | 01.06.1995 | 1 | as is where is | immediately |
106464 | Disco | DFD651 | 8 inch Dual Spindle Dicing Saw | 150 mm/200 mm | 01.06.2000 | 1 | as is where is | immediately |
106816 | Disco | DAD 321 | Automatic wafer dicing saw | 150 mm | 01.05.2001 | 1 | as is where is | immediately |
108155 | DISCO | DFG-82IF/8 | Rotary Surface Grinder | 200 mm | 01.06.1992 | 1 | as is where is | |
108396 | Disco | DFL7160 | Laser Saw | 300 mm | 1 | as is where is | ||
108397 | Disco | DFL7340 | Laser Saw | 200 mm | 01.01.2016 | 1 | as is where is | |
108398 | Disco | DFS8910 | Surface Planarization | 300 mm | 1 | as is where is | ||
108951 | Disco | DSC 141 | After Sawing Cleaner | 1 | as is where is | immediately | ||
109110 | Disco | DAD 3350 | Automatic Dicing Saw | 200 mm | 01.01.2008 | 5 | as is where is | immediately |
109111 | Disco | DFD 6240 | Fully automatic dicing saw | 200 mm | 01.06.2007 | 1 | as is where is | immediately |
109169 | DISCO | DFL7160 | Laser Saw | 300mm | 1 | as is where is | ||
109170 | DISCO | DFL7160 | Laser Saw | 300mm | 1 | as is where is | ||
109171 | DISCO | DGP8760/DFM2700 | Wafer Backside Grinder | 300mm | 1 | as is where is | ||
110721 | Disco | DFG 850 | Wafer Back Grinder | 200 MM | 01.06.2000 | 1 | as is where is | immediately |
110722 | Disco | DFG 850 | Wafer Back Grinder | 200 MM | 01.06.2004 | 1 | as is where is | immediately |
110745 | Disco | DTU 152 | Water Temperature Controller Unit | Assembly | 01.06.2016 | 5 | as is where is | |
110764 | Disco | DFL7340 | Laser Saw | 200 mm | 01.06.2011 | 1 | as is where is | immediately |
110800 | Disco | DGP8761 with DFM2800 | Wafer Back Grinder with Wafer Taper | 300 mm | 01.06.2012 | 1 | inquire | immediately |