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SDI ID Manufacturer Model Description Version Vintage Q. ty Sales Conditions Lead Time
110720 Datacon 2200 apm MultiChip Die Bonder 300 MM 01.06.2007 1 as is where is immediately
106467 EO Technic CSM-2000 CHIP SCALE LASER MARKER 150 mm/200 mm 01.06.2002 1 as is where is immediately
106469 EO Technics CSM2000 CHIP SCALE LASER MARKER 150 mm/200 mm 1 as is where is immediately
106470 EO TECHNICS CSM2000 CHIP SCALE LASER MARKER 200 mm 01.06.2005 1 as is where is immediately
101819 EVG 820 Mold Carrier Lamination System 200mm 1 inquire
108816 EVG Smart View Wafer Aligner - Parts Only 1 inquire
109593 EVG Gemini Automated Production Wafer Bonder 300 mm 1 inquire
109610 EVG 501 Wafer Bonder 200 mm 1 inquire
109611 EVG 520 Wafer Bonder 150 mm 1 inquire
110746 EVG Gemini Wafer Bonding system - permanent bonding system 150 mm 01.06.2015 5 as is where is immediately
108158 GSI CSP200 Wafer Level Die Marking System 200 mm 1 as is where is
108192 PAC TECH SB2-SM SOLDER BALL BUMPER 200 mm 1 as is where is
110733 POWATEC 850 Manual Wafer Mounter 01.06.2000 1 as is where is immediately
108299 Suss MicroTec CB200 High Pressure Wafer Bonding Chamber 200 mm 01.06.2012 1 as is where is immediately
108128 TOK 12262 Wafer bonder 1 as is where is
108129 TOK 12263 Wafer Debonder 1 as is where is
103635 Toray SP-500w Bump Height Measurement 300 mm 1 as is where is
108130 TORAY FC3000L2 FLIP CHIP Line 0 as is where is
106557 Ultron UH108 Ultron Tabletop Laminator 150 mm/200 mm 01.06.2005 1 as is where is immediately
106559 Ultron UHI08-12 Ultron Tabletop Laminator 200 mm / 300 MM 1 as is where is immediately
106560 V-Tek TM-330 TM-330 150 mm/200 mm 1 as is where is
106563 Veeco Wyko NT3300 3D Bump Height (Veeco) 150 mm/200 mm 1 as is where is immediately


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