Please find below a list of Pre-owned Die and Wire Bonding Equipment for sale by fabsurplus.com . All items are sold in "AS IS , WHERE IS" conditions unless otherwise indicated. Click on any list item to see further data. Items can be provided operational to OEM specifications on request.
| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
|---|---|---|---|---|---|---|---|---|
| 108727 | ALPHASEM | Swissline 9006 (Spares) | Automatic Epoxy Die Bonder, Parts Tool Only | 200 mm | 01.04.1993 | 1 | as is where is | immediately |
| 83601 | ASM | Extraction and Inspection of the Leadframe | Assembly | 1 | as is where is | immediately | ||
| 83602 | ASM | MC 609H | left:Leadframe in Magazine, transport in one of the ten Ovens, Cooling Station, right side: Leadframe out of Magazine | 1 | as is where is | |||
| 83603 | ASM | IBE 139H | Rotary Station then Buffered in Magazine and from Magazine to Wirebonder | 1 | as is where is | |||
| 83605 | ASM | DS 830 | Double Head Dispenser, left: Magazin, right: Leadframe | 1 | as is where is | |||
| 83606 | ASM | Extraction and Inspection of the Leadframe | 1 | as is where is | ||||
| 83607 | ASM | MC 609H | left:Leadframe in Magazine, transport in one of the ten Ovens, Cooling Station, right side: Leadframe out of Magazine | 1 | as is where is | |||
| 83609 | ASM | SLS 230T | left: IC cup and testing good/bad and than sorting in small tube | 1 | as is where is | |||
| 83610 | ASM | TLB 203EX | Testing | 1 | as is where is | |||
| 83611 | ASM | SLT400 | left: IC cup, Taping on Reel | 1 | as is where is | |||
| 106884 | ASM | AS899 (Spare Parts) | Spare Parts for Pick and Place Die Bonder | Spares | 01.06.2009 | 51 | as is where is | immediately |
| 108062 | ASM | HUMMING BIRD | STUD BUMP | ASSEMBLY | 1 | as is where is | ||
| 108257 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108258 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108259 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108260 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108261 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108262 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108263 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108264 | ASM | Siplace CA4 | High volume automatic flip-chip bonder | 200 mm | 01.06.2014 | 1 | as is where is | |
| 108382 | ASM | Eagle Xtreme | Wire Bonder | ASSEMBLY | 1 | as is where is | ||
| 108383 | ASM | Eagle Xtreme | Wire Bonder | ASSEMBLY | 1 | as is where is | ||
| 109030 | ASM | AD810 | Automatic Die Attach Tool | Assembly | 01.09.2017 | 1 | as is where is | immediately |
| 106950 | Delvotec | 6200 | Gold Ball Wire Bonder | Assembly | 01.06.2007 | 1 | as is where is | immediately |
| 108956 | Delvotec | 4500/Sieplace A2 | Die Bonder | 01.06.2006 | 1 | |||
| 103737 | Diener | Tetra 30LF PC | Plasma Surface Treatment Machine | 01.05.2016 | 1 | as is where is | immediately | |
| 106301 | EO TECHNICS | PEM402 | Die Bonder | 200 mm | 01.06.2012 | 1 | as is where is | immediately |
| 100704 | ESEC | 3018 | Gold Ball Bonder | Assembly | 1 | as is where is | immediately | |
| 100705 | ESEC | 3088 | Gold Ball Bonder | Assembly | 1 | as is where is | immediately | |
| 108272 | ESEC | 2008HSPLUS | Die Bonder | ASSEMBLY | 01.06.2007 | 1 | as is where is | |
| 108273 | ESEC | DB 2007 SSI plus | Die Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108274 | ESEC | DB 2007 SSI Plus | Die Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108275 | ESEC | Die Bonder 2007 FS | Die Bonder | ASSEMBLY | 01.06.2001 | 1 | as is where is | |
| 108749 | ESEC | BU-050-N | Parts Unloader for Micron 2 Automatic Die Attacher | 1 | inquire | |||
| 108750 | ESEC | BL-050-N | Parts Loader for Micron 2 Automatic Die Attacher | 1 | inquire | |||
| 108815 | ESEC | CT-2000 | Automatic Flip Chip Die Attacher, 3ea Available | ASSEMBLY | 1 | inquire | ||
| 103140 | EVG | 520 | Manual Wafer Load Substrate Bonder | 150 mm | 01.05.2003 | 1 | as is where is | 2 months |
| 106917 | K AND S | SPRINT | HIGHSPEED AUTOMATIC WIRE BONDER | ASSEMBLY | 1 | as is where is | immediately | |
| 108971 | K AND S | AT Premier | Wafer Stud Bumping Bonder | Assembly | 01.06.2006 | 1 | as is where is | immediately |
| 109000 | K AND S | 4523 | Manual Wedge Bonder | Assembly | 1 | as is where is | immediately | |
| 109028 | K AND S | 8028 | Automatic Ball Bonder | Assembly | 01.03.2000 | 1 | as is where is | immediately |
| 108756 | K&S | 1471 | Automatic wedge bonder | Assembly | 2 | as is where is | immediately | |
| 108757 | K&S | 1488 Plus | Automatic Gold Ball Bonder | Assembly | 01.05.1997 | 1 | as is where is | immediately |
| 108823 | K&S | 4123 | Manual Wedge Bonder | ASSEMBLY | 1 | inquire | ||
| 108824 | K&S | 4124 | Manual Thermosonic Ball Bonder | ASSEMBLY | 1 | inquire | ||
| 108825 | K&S | 4129 | Manual Deep Access Wedge Bonder | ASSEMBLY | 1 | inquire | ||
| 108826 | K&S | 4526 | Manual Wedge Bonder, with Vertical Wire Feed | ASSEMBLY | 1 | inquire | ||
| 108827 | K&S | 6497 | Semi-Automatic Flip Chip Epoxy Die Bonder | ASSEMBLY | 1 | inquire | ||
| 108828 | K&S | 8020 | Automatic Ball Bonder | ASSEMBLY | 1 | inquire | ||
| 108829 | K&S | 8028 | Automatic Ball Bonder | ASSEMBLY | 1 | inquire | ||
| 108830 | K&S | 8060 | Automatic Wedge Bonder | ASSEMBLY | 1 | inquire | ||
| 108832 | K&S | 4524AD | Manual Thermosonic Ball Bonder | ASSEMBLY | 1 | inquire | ||
| 84063 | Leica | MZ 12.5 | Microscope | 1 | as is where is | |||
| 84064 | Leica | MZ 8 | Microscope | 1 | as is where is | immediately | ||
| 84065 | Leica | MZ 6 | Microscope | 1 | as is where is | |||
| 109029 | MRSI | 505 | Die Attach/ Multichip Module | assembly | 01.01.2001 | 1 | as is where is | immediately |
| 108100 | Orthodyne | 360CHD | Wire Bonder | ASSEMBLY | 1 | as is where is | ||
| 108101 | Orthodyne | OE7200 | Wire Bonder | ASSEMBLY | 1 | as is where is | ||
| 108859 | ORTHODYNE | 20B | Heavy Wire Bonder | ASSEMBLY | 1 | inquire | ||
| 103819 | Palomar | 3500-III | Die Bonder | Assembly | 1 | as is where is | immediately | |
| 108478 | Palomar Technologies | 3500 III | Bonder | ASSEMBLY | 1 | as is where is | ||
| 108298 | Shinkawa | ACB400 | Wire Bonder | ASSEMBLY | 01.06.2004 | 1 | as is where is | |
| 108594 | SHINKAWA | COF 300 | Flip Chip Bonder | Assembly | 01.05.2005 | 5 | as is where is | immediately |
| 108595 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.05.2008 | 6 | as is where is | immediately |
| 108596 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.05.2007 | 22 | as is where is | immediately |
| 108597 | SHINKAWA | UTC-3000WE | Wire Bonder | Assembly | 01.05.2012 | 1 | as is where is | immediately |
| 108491 | TDK / PFA | AFM-1501 | Flip Chip Bonder | ASSEMBLY | 10 | as is where is | ||
| 108302 | TOSOK | DBD4600 | DIE BONDER | ASSEMBLY | 01.06.2010 | 1 | as is where is | |
| 108303 | tosok | EBD3570 | Die attach system | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 108304 | tosok | EBD3570 | Die attach system | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
| 109033 | WEST BOND | 10490 | Convertible Bonder , Wedge to Ball | Assembly | 1 | as is where is | immediately | |
| 109034 | WEST BOND | 2416B | Automatic Wedge Bonder | Assembly | 1 | as is where is | immediately | |
| 108783 | WEST-BOND | 7200A | Manual Epoxy Die Bonder | Assembly | 1 | as is all rebuilt | immediately |