Please find below a list of Pre-owned Die and Wire Bonding Equipment for sale by fabsurplus.com . All items are sold in "AS IS , WHERE IS" conditions unless otherwise indicated. Click on any list item to see further data. Items can be provided operational to OEM specifications on request.
SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
---|---|---|---|---|---|---|---|---|
108727 | ALPHASEM | Swissline 9006 (Spares) | Automatic Epoxy Die Bonder, Parts Tool Only | 200 mm | 01.04.1993 | 1 | as is where is | immediately |
106884 | ASM | AS899 (Spare Parts) | Spare Parts for Pick and Place Die Bonder | Spares | 01.06.2009 | 51 | as is where is | immediately |
108257 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
108258 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
108259 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
108260 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
108261 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
108262 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
108263 | ASM | EAGLE 60 | Gold Ball Bonder | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
108264 | ASM | Siplace CA4 | High volume automatic flip-chip bonder | 200 mm | 01.06.2014 | 1 | as is where is | |
109030 | ASM | AD810 | Automatic Die Attach Tool | Assembly | 01.09.2017 | 1 | as is where is | immediately |
110594 | Delvotec | 4500/Siplace A2 | Die Bonder | Assembly | 01.06.2006 | 1 | as is all rebuilt | immediately |
110595 | Delvotec | 6200 | Gold Ball Wire Bonder | Assembly | 01.06.2007 | 1 | inquire | immediately |
100704 | ESEC | 3018 | Gold Ball Bonder | Assembly | 1 | as is where is | immediately | |
100705 | ESEC | 3088 | Gold Ball Bonder | Assembly | 1 | as is where is | immediately | |
108272 | ESEC | 2008HSPLUS | Die Bonder | ASSEMBLY | 01.06.2007 | 1 | as is where is | |
108749 | ESEC | BU-050-N | Parts Unloader for Micron 2 Automatic Die Attacher | 1 | inquire | |||
108750 | ESEC | BL-050-N | Parts Loader for Micron 2 Automatic Die Attacher | 1 | inquire | |||
108815 | ESEC | CT-2000 | Automatic Flip Chip Die Attacher, 3ea Available | ASSEMBLY | 1 | inquire | ||
103140 | EVG | 520 | Manual Wafer Load Substrate Bonder | 150 mm | 01.05.2003 | 1 | as is where is | 2 months |
109282 | Hesse & Knipps | BJ855 and BJ820 | Wedge Bonders , magazine to Magazine | Assembly | 01.06.2019 | 26 | as is where is | immediately |
109578 | HITACHI | CM-700H | WIRE BONDER | ASSEMBLY | 01.05.2007 | 20 | inquire | immediately |
106917 | K AND S | SPRINT | HIGHSPEED AUTOMATIC WIRE BONDER | ASSEMBLY | 1 | as is where is | immediately | |
109028 | K AND S | 8028 | Automatic Ball Bonder | Assembly | 01.03.2000 | 1 | as is where is | immediately |
108756 | K&S | 1471 | Automatic wedge bonder | Assembly | 2 | as is where is | immediately | |
108757 | K&S | 1488 Plus | Automatic Gold Ball Bonder | Assembly | 01.05.1997 | 1 | as is where is | immediately |
108823 | K&S | 4123 | Manual Wedge Bonder | ASSEMBLY | 1 | inquire | ||
108824 | K&S | 4124 | Manual Thermosonic Ball Bonder | ASSEMBLY | 1 | inquire | ||
108825 | K&S | 4129 | Manual Deep Access Wedge Bonder | ASSEMBLY | 1 | as is all rebuilt | ||
108826 | K&S | 4526 | Manual Wedge Bonder, with Vertical Wire Feed | ASSEMBLY | 1 | inquire | ||
108827 | K&S | 6497 | Semi-Automatic Flip Chip Epoxy Die Bonder | ASSEMBLY | 1 | as is all rebuilt | 1 month | |
108828 | K&S | 8020 | Automatic Ball Bonder | ASSEMBLY | 1 | inquire | ||
108829 | K&S | 8028 | Automatic Ball Bonder | ASSEMBLY | 1 | inquire | ||
108830 | K&S | 8060 | Automatic Wedge Bonder | ASSEMBLY | 1 | inquire | ||
108832 | K&S | 4524AD | Manual Thermosonic Ball Bonder | ASSEMBLY | 1 | inquire | ||
109029 | MRSI | 505 | Die Attach/ Multichip Module | assembly | 01.01.2001 | 1 | as is where is | immediately |
108859 | ORTHODYNE | 20B | Heavy Wire Bonder | ASSEMBLY | 1 | inquire | ||
103819 | Palomar | 3500-III | Die Bonder | Assembly | 1 | as is where is | immediately | |
108594 | SHINKAWA | COF 300 | Flip Chip Bonder | Assembly | 01.05.2005 | 5 | as is where is | immediately |
108595 | SHINKAWA | UTC-2000 SUPER | Wire Bonder | Assembly | 01.05.2008 | 6 | as is where is | immediately |
108596 | SHINKAWA | UTC-1000 SUPER | Wire Bonder | Assembly | 01.05.2007 | 22 | as is where is | immediately |
108597 | SHINKAWA | UTC-3000WE | Wire Bonder | Assembly | 01.05.2012 | 1 | as is where is | immediately |
108304 | tosok | EBD3570 | Die attach system | ASSEMBLY | 01.06.2005 | 1 | as is where is | |
109033 | WEST BOND | 10490 | Convertible Bonder , Wedge to Ball | Assembly | 1 | as is where is | immediately | |
109034 | WEST BOND | 2416B | Automatic Wedge Bonder | Assembly | 1 | as is where is | immediately | |
108783 | WEST-BOND | 7200A | Manual Epoxy Die Bonder | Assembly | 1 | as is all rebuilt | immediately |