SDI fabsurplus.com is pleased to announce the availability of the following listed used Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System.
Please click on the "Get Quote" button at the end of the C7103 description, if you'd like to get a quotation, photos and specifications of this PC Controlled IC Back-side Lapping and Wafer Grinding System, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This Hamamatsu C7103 PC Controlled IC Back-side Lapping and Wafer Grinding System is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
|Description:||PC Controlled IC Back-side Lapping and Wafer Grinding System|
|Version:||200 mm and packages|
|Sales Condition:||as is where is|
The C7103 is a computerised IC backside polishing system for use when preparing a
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