ULVAC NE 7800 high-temperature, high-density plasma etching system for Sale

De-installed, warehoused. Can be inspected by appointment. ULVAC FERROELECTRIC ETCHER Like New Condition System installed in October of 2007, decommission in Feburary of 2008. Used in a R&D application The Ulvac NE 7800 is a high-temperature, high-density plasma etching system utilizing an Inductive Super Magnetron source (ICP with magnetic field). The NE 7800 is a dual load locked, cassette to cassette system designed for both R&D and production applications. Outstanding metal etching process stability for Pt/Ir/magnetic films and difficult to etch materials such as FeRAM and MRAM devices. Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Number of Chambers 4 Process Capabilities Ta, FeRAM, RRAM, MRAM Preheat Chamber IR heater Range: 200 to 600 deg C Chamber 2 Description ISM ICP Etch ESD Chuck, 450C, He BS Cooling Bias power: 2000W, 400 KHz Antenna power: 3000W, 13.56 MHZ UTM 1400FW/DIK Turbo Pump Ebara ESR20N Dry Pump Gases: Ar, O2, SF6, C4F8, HBr, CL2, BCl3, CHF3 Chamber 3 Description ISM ICP Etch ESD Chuck, He BS Cooling Bias power: 2000W, 400 KHz Antenna power: 3000W, 13.56 MHZ UTM 1400FW/DIK Turbo Pump Ebara ESR20N Dry Pump Gases: Ar, O2, SF6, C4F8, HBr, CL2, BCl3, CHF3 Chamber 4 Description Microwave Ashing Chamber Heated Chuck, 280C Bias power: 600W, 13.56 MHz Microwave power: 3000W, 2.45 GHz Endpoint detection Ebara ESR200WN Dry Pump Gases: 02, 02, H2/N2, CF4, N2 External Cooling Water Cooled Other Information (3) Cassette load ports (2) SMC Corp Model HRZ002 Chiller-Etch Chambers (1) Ebara ESR20N dry pump, loadlock/xfer mod