ASML Twinscan XT400F i LINE SCANNER for Sale

The XT:400 is a dual-stage lithographic exposure tool designed for volume 200-mm and 300-mm wafers production down to 220-nm resolution.
The dual wafer stage technology of the XT platform enables the exposure of one wafer and
the alignment and mapping of the next wafer to take place in parallel, thereby virtually eliminating
overhead time and allowing for continuous patterning of wafers. The level sensor, in combination
with the TWINSCAN leveling approach, virtually eliminates differences between inner die and edge
die and ensures high yield across the entire 300-mm wafer.
High throughput and yield are combined with fast reticle exchange times and Lot Streaming to provide the lowest cost of operation.

Lens
Wavelength: 365 nm
NA: 0.48-0.65
Resolution (standard): ≤ 350 nm
Resolution (annular): ≤ 280 nm
Resolution (annular + High Res.): ≤ 220 nm
Field size, for reticle with pellicle
• Max X: 26.0 mm
• Max Y: 33.0 mm
Distortion (Dynamic)
• Conventional:
≤ 30 nm
Overlay
Single-machine (TOP-2): ≤ 12 nm
Matched-machine (TOP-2): ≤ 20 nm

Machine Specific data

-currently installed in the fab and running wafers
-track model: Lithius
s/w version installed: AT 4.1.0.c 0274c
CONFIGURATION
2 Sided IFM-beams for WS-X (expose): Not available
2 Sided IFM-beams for WS-X (measure): Not available
2D Barcode Reader: Absent
2D grid correction: Disabled
AA processing rack: MPCR processing rack
Active wafer release for dry WS: FALSE
Air Gauge: Absent
Air Gauge Improved Levelling: Absent
ALE 1 Use: Lens heating only
Alignment Camera Mirror: Absent
Alignment laser configuration: 2 color laser
Alignment Sensor Type: Athena Narrow Marks OM
Allow different Exp: Absent
Allow even orders usage: Absent
Allow L1L7 Type 1 Optimization: Absent
Allow wafer plane deviation check with Focus Monitoring: Disabled
Application Type: Scanner Application
Assure System Snapshots: Assure System Snapshots not allowed
Ast offset correction in TIS LHFB/LOCO (Version 3): Enabled
Athena Focus Improvements 1: Absent
Athena Narrow Marks Twinscan: Present
Attenuator Type: Discrete 16 Transmissions
Automated DOE Exchanger: Absent
Automated DOE Exchanger Architecture: 5 slots MIP Control
Automated Lens Heating Calibration: Disabled
Automated Reticle Transport System: Absent
Automatic CUA: Absent
Automatic CUA exchanger architecture: Not applicable
Automatic PCE exchanger: Absent
Avoid Track INPUT/OUTPUT conflicts: Avoid Track INPUT/OUTPUT conflicts enabled
BALE Type: Dont Care
BaseLiner focus control.: BaseLiner-Focus application is disabled.
BaseLiner focus high order intrafield: BaseLiner-Focus high order intrafield is disabled.
BaseLiner overlay control.: BaseLiner-Overlay application is disabled.
Beam Control: None
board configuration: ODB + ADB
Bubble Extraction Seal Setting: Not Applicable
Capacitive z-height sensor type.: Extended Z sensor board
Carrier Handler Type: Mark II 300 Foup
CDC: Enabled
Changed Short Stroke diff XY controller: Disabled
Choice of avoidance routing.: Absent
Chuck 1 wafer size: 300mm
Chuck 2 wafer size: 300mm
Chuck Dedication: Basic
Circuit Dependent FEC: Absent
Clean Air Configuration: Others
Clean Air Temperature Control: Driver and ACC
Closing disk type: No closing disk present
Combined stage alignment: Disabled
Constrained fit: Disabled
Continuous clampable wafer table for dry WS: Absent
CT Miscellaneous Rack: Present
Data collection not covered by FOCUS and OVERLAY: InformPro Data Collection disabled.
Depolarizer type: not applicable
Describes at what plane the BMU measures: Not applicable for uv systems
Determination of NA ellipticity: Disabled
Diaphragm Limiter: Absent
Diff pressure correction for IFM beams: Absent
Docking wheels at WH unload: Absent
Dose Intensity Optimization: Disable Dose Intensity Optimization;
Dose System Performance Test for Lithoguide: Absent
Dosecontrol Hardware: ISB
DOSEMAPPER: Absent
DoseSystemPerformanceTest sequence: Test sequence 0
DOSE_MAPPER_1: Absent
Double TIS scan: Disabled
DUV Lightsource Power Level: Not applicable
Dynamic Performance Calculation: Mark 1
E-chuck Flatness Qualification Test: Disabled
EDA Interface: Disabled
EFESE: Absent
Enable the Maintenance Assistant: Disable Maintenance Assistant
Enable to support SMASH XY mark types.: SMASH XY marks are not supported.
Energy Sensor: CrismaTec
Enhanced Exposure Overlay: Absent
Enhanced exposures 1: Absent
Enhanced Throughput Reticle Alignment: Present
Enhancements in Reticle Monitor: no enhancements
Equipment Constants via SECS interface: Enabled
Exchangeable Last Lens Element: Absent
Exchangeable Pupil Lens Element: Absent
Extend IRIS maximum particles scanned to 50000.: Absent
extended docking interface at Prealigner: ECC_0MM
Extended LS areas: Disabled
Extended Spot Sensor Matching: Absent
Extended Zone Alignment: Disabled
Extreme Clean Humiditied Air: Absent
Field width optimised leveling: Disabled
FOCAL Measurement for Lithoguide: Absent
Focus Data Collection: Absent
Focus Monitoring: Present
FSM Flexibility package: Disabled
Functional use of Active Elements: No AE element
Gas Control Unit Type: High Flow (HF)
Gridmapper: Disabled
Ifm config at measure side.: 7 axes
IFM Laser Configuration: AOM Recombo Laser
ILIAS Functionality For Lithoguide: Absent
ILIAS lens setup: Absent
ILIAS Sensor Location: Absent
ILIAS sensor type chuck 1: None
ILIAS sensor type chuck 2: Zernike only
Illumination modes: All illumination modes
Illuminator platform: Aerial 1
Illuminator Type: 39
Imaging Control Rack Configuration: IMCR
Imaging Electronics Architecture: B Architecture
Imaging Fading Control: Disabled
Imaging Generic Power Amplifier: Ten Axis Power Amplifier
Immersion: Absent
Immersion Hood version: Absent
Improved Contrast Control: Absent
Improved Edge Field Leveling: Disabled
Improved Maintenance action scheduling.: Disabled
Improved wafer reject mode: Disabled
Improvements for reticle handling: Disabled
In situ Wafer Table Stone Cleaning: Absent
Indication what kind of AM controller hardware is present: SUCR
Inlet restriction for clean air: Absent
Insert a delay time before starting a Lot (lens heating).: Disabled
Integrated Reticle Inspection System: PPD1 with IRIS1 functionality.
Integrated Reticle Inspection System Configuration.: Disable creation of OSIRIS viewable files.
Integrated Reticle Library: IRL with original functionality
Intensity Calibration Per DOE: Disabled
Interferometer axis version at exposure: 3 plus 1 axis
Interferometer Electronics: Ifsr
Intrafield Higher Order Process Corrections: Disabled
Iris feature Scan: Absent
Is NA accuracy measurement allowed?: Disabled
ISIS Functionality For Lithoguide: Absent
Laminar Bottom Hood: Absent
Laser Gas Life eXtension: Disable Laser Gas Life eXtension;
Layout Version Number TIS Plate 1 on Chuck 1: TIS Plate 1 Layout Version 4
Layout Version Number TIS Plate 1 on Chuck 2: TIS Plate 1 Layout Version 4
Layout Version Number TIS Plate 2 on Chuck 1: TIS Plate 2 Layout Version 4
Layout Version Number TIS Plate 2 on Chuck 2: TIS Plate 2 Layout Version 4
LCI WaitWatcher plug-in: Absent
LCW Circuit set-up: Flow Version 1
LEC Rack in Electronic Architecture: Absent
Lens Circuit Water Flow: Normal
Lens Heating Feedback: Absent
Lens Top Tool Connection: Lens Top Tool can be mounted on top of the Lens
Lens Type: 41
Level Sensor Processing Rack: MPCR
Leveling Verification Test for Lithoguide: Absent
Levelling throughput improvement on measure side: No levelling throughput package
Light-source Architecture: HG Lamp
Light-source Type: Lamp
Light-source Wave-length: 365nm
Lithoguide Imaging Recipes: Absent
Log missed translations: Disabled
Lot Alignment Report Encryption: Unencrypted
Lot Correction Sequence: Type B
Lot Overhead Reduction: LOR2
Lot Report Data Category: Enhanced Diagnostics
LS focus node: LS focus node 1
LS spot coverage: Absent
LS_CPU_CONFIG: 2 CPUs available
LS_PEMM_CONFIG: Present

Max alignment speed: Setting 2
Maximum Reticle ID Length: 24 Characters
mbds control: Present
MDL Viewer: Site View
Method for alignment of the laser beam: Not applicable for UV systems
Metroframe Circuit Water Cabinet: Absent
Metroframe type: TYPE_A
Modelling for MAXYS: Absent
Motor Circuit Water Flow: Normal
Multifunction Active Lens Element: 0
Multifunctional Active Elements: 0
Multilingual UI: Absent
NA Control Architecture: NA2 Torlon
NA Control Type: 39
NA1 motor type: None
Nitrogen Purge Utility Control: Absent
Nitrogen purging of Reticle Stage: RS is not purged
Number of Active Elements: 0
Number of Active Lens Elements: 0
Number of Active Manipulator Elements: 0
Number of Bi-directional Active Lens Elements: 0
Number of EXLE elements: 0
Number of Half Dome Mirrors: 0
Number of Lens NEXZ Manipulators: 0
Number of Lens Z Manipulators Using Camdisk: 2
Number of manipulable ELLE axes: 0
Number of Motion Controllers: 5 Motion Controllers present
Number of pre-amps available per Z-manipulator: 1
Number of RMCS clients: No clients
Number of Rxm: 0
Number of Rym: 0
Number of Semi-Active X-Y Lens Manipulators: 0
Number of Z Lens Manipulators: 2
OADB Improved Dynamic Range: Disabled
Off-axis slit: Projection lens has no off-axis slit.
Online Lamp Peak: Disable Online Lamp Peak;
Overlay Data Collection: Overlay Data Collection disabled.
Overlay Node: Level 5
Parameter indicates how long overlay data will be stored.: Short retention period.
Particle Extraction Mass Flow Meter: Absent
Patch strategy: Patchlevel
Pattern Matcher: Absent
PCE Location: not applicable
PDOC quality indicator check: PDOC quality indicator functionality is absent
PED control mode: Absent
PEP Image Streaming: Absent
PEP-ADC Intensity: Disable PEP-ADC Intensity;
Performance Enhancement Package: 1
Piezo Active Lens Mounts: Absent
Point-to-Point LS Machine Matching: Disabled
Polarization: Absent
Polarization Shaping Element Retractor: No PSER hardware installed in the machine
Polarized illumination amorph DOE.: Only unpolarized illumination.
Position Control Motion Control rack: MPCR
Position Control Power Rack Configuration: TYPE_4
Position of Spot Sensor on Chuck 1: Spot Sensor Position on Chuck 1 layout 1
Position of Spot Sensor on Chuck 2: Spot Sensor Position on Chuck 2 layout 1
Pressure update rate for fringelength correction: Pressure update rate 2 or 4 Hz
Process Dependent Gain Correction: Absent
Projection GPA Configuration Version: Version 2
Proximity Matching: Absent
PSE Location: not applicable
PUPICOM: Absent
PUPICOM Architecture: DC Motor
PUPIL Measurement For Lithoguide: Absent
Pupil measurements with ILIAS: Absent
Pupil qualification method: Centre of gravity method
Pupil TIS angular sensitivity calibration and correction: TIS Pupil Measurement will not be improved
Purge Hoods configuration: Absent
purging configuration: purging CONFIG 1
Readout location of Pneumatic Facility Unit sensors: CT sensor board (CTS)
Recipe Creator: Light
Reduced capture range for TIS scans: Disable reduced range TIS scan scenarios
Relative direction of ws to rs on the X axis: Same
REMA architecture: REMA C
Reorder Lot Service: Present
Reticle Align High Precision: Absent
Reticle Balance Mass 1 amp.: 450V20A: PAAC AT-pepD
Reticle Balance Mass 2 amp.: 450V20A: PAAC AT-pepD
Reticle Carrier Location: Right
Reticle Carrier Tag Reader: Present
Reticle exchange type: Retex option
Reticle Handler type: RH Mark III
Reticle Level Polarization Sensor: Absent
Reticle shape correction: Disabled
Reticle Size: 6 inch
Reticle Stage Chuck Type: TYPE_4
Reticle Stage Lenscooler Box: Lenscooler Box with anti-aliasing Filter
Reticle Stage Long Stroke Config: TYPE_5:CoFe_18 motor SIOB controlled int. vacuum supply magn. GC
Reticle Stage Long Stroke Motor Type: Cobalt Ferro 18 teeth
Reticle Stage Long Stroke Y11 amp.: 450V20A: PAAC AT-pepD
Reticle Stage Long Stroke Y12 amp.: 450V20A: PAAC AT-pepD
Reticle Stage Long Stroke Y21 amp.: 450V20A: PAAC AT-pepD
Reticle Stage Long Stroke Y22 amp.: 450V20A: PAAC AT-pepD
Reticle Stage Measurement System on Scan: Heidenhain Encoders
Reticle Stage purged mini environment: Absent
Reticle Stage Short Stroke X amp.: PADC 100V/18A
Reticle Stage Short Stroke Y11 amp.: PADC 100V/18A
Reticle Stage Short Stroke Y12 amp.: PADC 100V/18A
Reticle Stage Short Stroke Y21 amp.: PADC 100V/18A
Reticle Stage Short Stroke Y22 amp.: PADC 100V/18A
Reticle Stage Short Stroke Z1 amp.: PADC 100V/18A
Reticle Stage Short Stroke Z2 amp.: PADC 100V/18A
Reticle Stage Short Stroke Z3 amp.: PADC 100V/18A
Reticle streaming: Disabled
Reticle streaming lite: Disabled
RS Object Field: Normal
SAMOS Stray Light Test For Lithoguide: Absent
SASO robustness and fiber connectivity: Disable SASO robustness
Save throughput data to the disk: Disabled
Scanning Energy Sensor Calibration: Static Energy Sensor Calibration
Settle time reduction to improve the throughput: Dont care
Setup sensor board version: Setup SSD not available
Shot Data Collection: Present
SMASH Reuse Capture Information in Stage Alignment: Coarse capture scans are done on all stage alignment marks.
Smooth Field Uniformity: Absent
Specifies chuck1 config: Dry
Specifies chuck1 layout relev. for Immersion: Chuck does not support immersion
Specifies chuck1 version: not specified
Specifies chuck2 config: Dry
Specifies chuck2 layout relev. for Immersion: Chuck does not support immersion
Specifies chuck2 version: not specified
Specifies which mark types are supported: ASML marks only
SPM temp correction for lens axis: Disabled
Spot Sensor Chuck 1: CrismaTec
Spot Sensor Chuck 2: CrismaTec
Spot Sensor Reticle Stage: Absent
Stage Alignment Filter: Absent
Stages Sample Rate: 5.0 kHz
Stand-alone Workstation: FALSE
Symmetrical Reticle Alignment: Disabled
Test Table: Absent
Test table architecture: Aerial 2
Test Table Z Axis: Worm Wheel
THFFC FDE model lens dependent: Disabled
TIS diffuser: TIS diffuser absent
TIS plate deformation correction: Disabled
TOP HD: Absent
Track Pre-warning signal (APR): APR enabled
Type: 400F
Type of Air Gauge: No Air Gauge device present
Type of immersion hood for immersion: None
Type of projection multiplexer board: MUX Absent
Type of wafertable on chuck 1 for immersion machine: Zerodur version 1
Type of wafertable on chuck 2 for immersion machine: Zerodur version 1
Ultra Pure Water flow controller (WICC): absent
UNICOM: Absent
UNICOM Architecture: 1 Motor
Uniformity Improvement Package: Absent
Universal Prealignment: Disabled
Usage of Energy Sensor data by TIS: Disabled
Usage of wavelength data by TIS: Disabled
Use Sigma Calibration: no Sigma Calibration
Use Sigma WIP Preserving Offsets: no Sigma WIP Preserving Offsets
Use validity ranges around UIP data when Enabled.: Use exact matching for UIP data
UV Shutter version: UV Shutter version 3
Version of RS/WS IO library: Version 1
Wafer Carrier Location: Right
Wafer Handler Productivity: Wafer Handler Productivity Level 1
Wafer Handler wrt BF Shifted in Z: Not Shifted
Wafer Handling Load Robot Type: Double Fold Arm 12 mm Z stroke
Wafer Handling Pneumatics: Standard
Wafer Handling Unload Robot Type: Double Fold Arm 12 mm Z stroke
Wafer Id Reader: Absent
Wafer Mark Sensor: Absent
Wafer Size: 300mm
Wafer Stage Balance Mass 11 amp.: Dont care
Wafer Stage Balance Mass 12 amp.: Dont care
Wafer Stage Balance Mass 21 amp.: Dont care
Wafer Stage Balance Mass 22 amp.: Dont care
Wafer Stage Configuration: Wafer Stage type 3 configuration
Wafer Stage Fast Stiff X Move Electronics: Present
Wafer Stage Long Stroke E CS amp.: 450V20A: PAAC AT-pepD
Wafer Stage Long Stroke E X amp.: 450V20A: PAAC AT-pepD
Wafer Stage Long Stroke E Y1 amp.: 450V20A: PAAC AT-pepD
Wafer Stage Long Stroke E Y2 amp.: 450V20A: PAAC AT-pepD
Wafer Stage Long Stroke M CS amp.: 450V20A: PAAC AT-pepD
Wafer Stage Long Stroke M X amp.: 450V20A: PAAC AT-pepD
Wafer Stage Long Stroke M Y1 amp.: 450V20A: PAAC AT-pepD
Wafer Stage Long Stroke M Y2 amp.: 450V20A: PAAC AT-pepD
Wafer Stage Mirror Block Down Electronics: Absent
Wafer Stage Short Stroke 1 XY1 amp.: PADC 100V/18A
Wafer Stage Short Stroke 1 XY2 amp.: PADC 100V/18A
Wafer Stage Short Stroke 1 XY3 amp.: PADC 100V/18A
Wafer Stage Short Stroke 1 Z1 amp.: PADC 100V/18A
Wafer Stage Short Stroke 1 Z2 amp.: PADC 100V/18A
Wafer Stage Short Stroke 1 Z3 amp.: PADC 100V/18A
Wafer Stage Short Stroke 2 XY1 amp.: PADC 100V/18A
Wafer Stage Short Stroke 2 XY2 amp.: PADC 100V/18A
Wafer Stage Short Stroke 2 XY3 amp.: PADC 100V/18A
Wafer Stage Short Stroke 2 Z1 amp.: PADC 100V/18A
Wafer Stage Short Stroke 2 Z2 amp.: PADC 100V/18A
Wafer Stage Short Stroke 2 Z3 amp.: PADC 100V/18A
Wafer Stage Type: Dual Chuck
Wafer Switch: Absent
Wafer Track: Present
Wafers per Carrier: 25
Wavelength Adjustable: Fixed
Wet Imaging Control Cabinet: Not Applicable
WH Robot Power Amplifier: CPM 20
WS Balance Mass: Stainless Steel
WS Immersion Hood Only Testrig: Absent
WS Immersion throughput package: None
XML Lot Report Content Level: Basic
XML output for LITHOGUIDE: Disabled
XT Architecture Revision: Rev2
ZERO Fiducial: ILIAS
Zeroing type for Encoders Measurement System: Using reference marks on the encoder scales
Zoom Axicon Architecture: ZA
Zoom Axicon Type: 39
Alignment Recipe Override: Alignment Recipe Override Disabled
Alignment Strategy ID Standard or Extended. Protected.: Alignment Strategy ID max length is 15 characters
Application Specific Lens Heating Calibration and Verification: Present
BaseLiner overlay high order intrafield: BaseLiner-Overlay high order intrafield is disabled.
CP 1A: Present
CP 1B: Absent
CP 2: Present
CP 3: Present
CP 4: Present
CP 5: Absent
CP 6: Absent
Docking plate height: Low
Extended X width masking range: Disabled
Fading Control Switch: Disabled
Fresnel corrections for WSSS: Disabled
Improve robustness DPCM mark: Disable DPCM mark robustness improvement
Integrated Reticle Inspection System Clipped Status: PPD2_1 System;
Lens heating History in LH Feedforward: Disabled
Level sensor Ry drift correction: Disabled
Lower Docking Plate: Present
Maximum numerical aperature (NA) that can be used in Lot Production: level 0
NEXZ-tilt per exposure: The NEXZ-tilt cannot be adjusted per exposure.
Pattern Matcher fullchip: Absent
PDO offset for EFL LS spots: Disabled.
Position Control Rack Configuration: Rack Configuration type 3
Reticle Cleaning: Absent
Safeguard to prevent loading of reticles with too wide or mispositioned pellicles: Disabled
Scan speed increase to improve the throughput: Dont care
Spotsensor surface coating: Metacolor
TestStream: TestStream disabled
Type of multi foil lens element: none
UV Shutter Optimized Open Time: Optimized UV Shutter Open Time V2
Wafer Handling Store Unit: Absent
Wafer Stress Relaxation: FALSE
WS Immersion thermal control package: None
Z-capture for low relfectivity wafers: Off