Brooks 241251-0007 Equipment front end module (EFEM) ASSY,JCP,2SR,S2,WE30,VGVG,XXLO,VIVIXXXX,30B,#3065 for Sale

Equipment Front End Module (EFEM):
Description: ASSY,JCP,2SR,S2,WE30,VGVG,XXLO,VIVIXXXX,30B,#3065
P/N: 241251-0007
Original price: $150,300
Documentation, etc.

Configuration of EFEM:-
-Standard base Platform including:-
-BOLTS compliant frame
-Doors, front and rear wheels
-Solid upper rear panel
-AC Power distribution (200-240V)
-Ethernet communications
-Externally mounted removable casters
-SEMI S2, S8 and F47 compliant

Application Information
Substrate 1: 300 mm Semi Std.
Substrate 2: 200 mm Semi Pitch
Ship Config: 300 mm
Process temp: less than 100C
Substrate temp: less than 100C
Transfer plane: 1100 mm from floor
Process throughput: 60 wph

Platform Configuration
Platform layout: 2 wide
Service access: Right (standard)
Interior lighting: White (Standard)
Facilities location: Internal - Side Service
Upper Panels: Tall with Storage
FFU Option: Standard FFu (Class 1)

Automation Configuration
Drive type: Custom
Robot track: Custom
Lower EE: Vacuum S9
Substrate Aligner: Custom
Upper EE: Vacuum S9
Aligner Location: Right (Standard)
System Reach Requirement: Reach into G2-6 side-by-side Load Lock.

Load Port Configuration
Carrier Type 1: 300 mm FOUP Semi Standard
Carrier Type 2: 300 mm FOUP with Adapter
CID Comm: Vision LPM ENET
LPM #1: Vision Load Port  
E84 Option: OHT Ready (no transponder)
Carrier ID: RFID - Brooks
LPM #2: Vision Load Port  
E84 Option: OHT Ready (no transponder)
Carrier ID: Not required

Standard EFEM Options
EMO Button: left side
UI Configuration: Mount with swing arm
Carrier protection: None
Light Tower: None
UI Location: Right corner
Wafer mapping: Loadport only (Vision)
Wing Panel: None
OCR Mount Bracket: None
Ionization: Ionization with digital control
Platform coupling: None

Custom Requirements
1. This EFEM will roll up to a G2-6 Gen5-EN vacuum Back End (p/n 139750-77).
2. JCP Level 2.5 gen-5 EN Controls architecture
3. System will be a 200 mm and 300 mm bridge tool. Automation is a wafer engine with a 200mm/300mm aligner. Aligner requires right side bump out.
4. LPM#2 will be vision compatible for FOUP with Microtool adapter p/n AM-3004-3
5. Tool configured for separate and dedicated 300 mm and 200 mm EEs on wafer engine amd set up for Microtool adapter p/n AM-3004-3 on LP#2