SDI fabsurplus.com is pleased to announce the availability of the following listed used ASM Siplace CA4 High volume automatic flip-chip bonder.
Please click on the "Get Quote" button at the end of the Siplace CA4 description, if you'd like to get a quotation, photos and specifications of this High volume automatic flip-chip bonder, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This ASM Siplace CA4 High volume automatic flip-chip bonder is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.
| SDI ID: | 108264 |
|---|---|
| Manufacturer: | ASM |
| Model: | Siplace CA4 |
| Description: | High volume automatic flip-chip bonder |
| Version: | 200 mm |
| Vintage: | 01.06.2014 |
| Quantity: | 1 |
| Sales Condition: | as is where is |
| Lead Time: | Inquire |
| Sales Price: | Inquire |
| Comments: | - High Volume Chip Assembly - 4 Portal Microchip / SMD Hybrid Assembly system - 4 Siplace Wafer Systems (SWS) 8" incl. 8" Wafer Expansion - 4 Wafer Transfer Systems - 4 LP-camera (TYP34) and bonding Head C+P20 SIPLACE CA4 incl. 4 Siplace Wafer Systems 8" Accessories Single transport Chuck Chiller Cooling System Vacuumpump X-Series Samples and product evaluation only. Condition Excellent Year of Manufacture 2014 CE Marked YES Exterior Dimensions Width 238.0 cm) Depth 384.0 cm) Height 186.0 cm) |
Get Quote |
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