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RUDOLPH NSX 105 Automated Wafer, Die and Bump Inspection System for Sale


SDI fabsurplus.com is pleased to announce the availability of the following listed used RUDOLPH NSX 105 Automated Wafer, Die and Bump Inspection System.
Please click on the "Get Quote" button at the end of the NSX 105 description, if you'd like to get a quotation, photos and specifications of this Automated Wafer, Die and Bump Inspection System, and your request for this equipment will be forwarded to our SDI sales representatives automatically.
This RUDOLPH NSX 105 Automated Wafer, Die and Bump Inspection System is available for immediate sale.
Crating, refurbishment and delivery for this equipment can be quoted on request.


RUDOLPH NSX 105 Equipment Details

SDI ID: 106871
Manufacturer: RUDOLPH
Model: NSX 105
Description: Automated Wafer, Die and Bump Inspection System
Version: 300 mm
Vintage: 01.06.2008
Quantity: 1
Sales Condition: as is where is
Lead Time: immediately
Sales Price: Inquire
Comments:

Dimensions on base: 72 in x 72 in x 80 in h , 2420 lbs
Has CE mark
Deinstalled and warehoused.
See photos for details.
Inspection is welcomed by appointment.
Manual loading.

 


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The data provided herein is not an offer capable of acceptance.
The information contained on this page is, to our knowledge and information, accurate, but it may contain errors and therefore we do not warrant the completeness or accuracy of the information contained on this page.
Any offer by you to purchase the equipment described on this page shall be subject to our standard terms and conditions of sale.

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