Please find below a list of Used Dicing Saws for sale by fabsurplus.com - Click on any dicing saw listed to see further data.Also included in this list are any other dicing saw related accessories.Wafer dicing, also known as die singulation,is the step in making a semiconductor device where dies are cut from the wafer.It can involve scribing and breaking, mechanical sawing with a dicing saw or laser cutting using a laser saw.
| SDI ID | Manufacturer | Model | Description | Version | Vintage | Q. ty | Sales Conditions | Lead Time |
|---|---|---|---|---|---|---|---|---|
| 90089 | DISCO | DFL7160 | WBL LASER SAW (DAF Type) | 300 mm | 01.05.2012 | 1 | as is where is | immediately |
| 106461 | Disco | DFD6361 | DICING SAW | 150-200 mm | 01.11.2009 | 1 | as is where is | immediately |
| 106462 | Disco | DFD6362 | DICING SAW | 150 mm/200 mm | 01.05.2016 | 1 | as is where is | immediately |
| 106463 | Disco | DFD651 | 8" Dual Spindle Automated DICING Saw | 150 mm/200 mm | 01.06.1995 | 1 | as is where is | immediately |
| 106464 | Disco | DFD651 | 8 inch Dual Spindle Dicing Saw | 150 mm/200 mm | 01.06.2000 | 1 | as is where is | immediately |
| 106816 | Disco | DAD 321 | Automatic wafer dicing saw | 150 mm | 01.05.2001 | 1 | as is where is | immediately |
| 108396 | Disco | DFL7160 | Laser Saw | 300 mm | 1 | as is where is | ||
| 108397 | Disco | DFL7340 | Laser Saw | 200 mm | 01.01.2016 | 1 | as is where is | |
| 109110 | Disco | DAD 3350 | Automatic Dicing Saw | 200 mm | 01.01.2008 | 5 | as is where is | immediately |
| 109111 | Disco | DFD 6240 | Fully automatic dicing saw | 200 mm | 01.06.2007 | 1 | as is where is | immediately |
| 109169 | DISCO | DFL7160 | Laser Saw | 300mm | 1 | as is where is | ||
| 109170 | DISCO | DFL7160 | Laser Saw | 300mm | 1 | as is where is | ||
| 110745 | Disco | DTU 152 | Water Temperature Controller Unit | Assembly | 01.06.2016 | 5 | as is where is | |
| 110764 | Disco | DFL7340 | Laser Saw | 200 mm | 01.06.2011 | 1 | as is where is | immediately |
| 71907 | Hamamatsu | C7103 | PC Controlled IC Back-side Lapping and Wafer Grinding System | 200 mm and packages | 30.09.2001 | 1 | as is where is | immediately |
| 32210 | Nitto | HR8500-2 | INSTRUCTION MANUAL | MANUAL | 1 | as is where is | immediately | |
| 83597 | Nitto | TT1R2-1 | teach pendant for robot TT1R2-1 | spares | 1 | as is where is | immediately |