KLA-Tencor 2135 Brightfield Wafer Defect Inspection System for Sale

-This equipment is a KLA 2135 inspection station
-It is set up for use with 8 inch wafers loaded via 2 x open cassettes

Generic Specification Sheet - KLA 2135
The 21xx is a fully automated wafer defect inspection system.It will detect defects both on patterned and on bare wafers.
The 21xx series includes the 2135, 2138 and 2139.
The 21x5 platform is a narrow-band brightfield defect inspection system.
The 2135 has a full frame alignment module that improves runtime alignment and improves the speed of random mode inspections.
This system is best used for application in which low noise is important, for design rules of 0.35 um or larger.The platform can be upgraded to a 2138 or 2139.
Pixel sizes installed:
Array inspection Pixels: Standard installed pixel sizes:1.25um, 0.62 um, 0.39 um, optional pixel size: 0.25 um
Random inspection Pixels: Standard installed pixel sizes:0.62 um, 0.39 um, 0.25 um . Optional pixel size: 1.25 um
Performance Specifications:-
Pixel 1.25 um
Defect sensitivity (um) array 0.50, random 1.0, speed 0.5 sec/cm2
Pixel 0.62 um
Defect sensitivity (um) array 0.30, random 0.60, speed 1.8 sec/cm2
Pixel 0.39 um
Defect sensitivity (um) array 0.20, random 0.40, speed 5 sec/cm2
Pixel 0.25 um (Optional)
Defect sensitivity (um) array 0.15, random 0.25, speed 10 sec/cm2
Standard software features:-
-NT operating system
-GUI system software
-Auto SAT /Chestnut
Software options that may also be present:-
-fast edge die inspection
-edge die sensitivity optimization
-segmented auto threshold
Other configuration options:-
-ISECS/DSECS GEM II
-ISMIF
-OCR
-LIGHT TOWER (3 OR 4 COLOR)
-EARTHQUAKE RESTRAINT KIT
-SYSTEM IS SHIPPED WITH THE CUSTOMER SPECIFIED WAFER SIZE INSTALLED. WAFER SIZES BETWEEN 100MM AND 200 MM MAY BE USED. For change of wafer size, it is necesary to install the optional wafer size conversion kit for the required wafer size.